Harmonized System

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Section XVI > Chapter 85 > Heading 8523 > 8523.5 > 8523.51

Classification opinions

… a plastic card. The PCB is not produced by thin- or thick-film technology. Data can be stored onto and read from the … frame by gluing. The PCB is not produced by thin- or thick-film technology. The dimensions of the device are …

Section VI > Chapter 38 > Heading 3808 > 3808.9 > 3808.94

Classification opinions

… control undesirable microorganisms such as bacteria (e.g., salmonella), yeasts or moulds. Application of GIR 1. …

Section IX > Chapter 44 > Heading 4418 > 4418.7 > 4418.79

Classification opinions

… construction. The panels are provided with a polypropylene film (moisture balancer) on the underside and are tongued …

Section XVI > Chapter 85 > Heading 8541 > 8541.4 > 8541.43

Classification opinions

… 1. Thin-film solar module (dimensions L x W x H : 1409 x 1009 x 46 …

Section XVI > Chapter 84 > Heading 8467 > 8467.1 > 8467.19

Classification opinions

… metal, non-rotary, fan-shaped, used for harvesting olives, almonds and pistachios. It is powered by air from a …

Section VI > Chapter 29 > Heading 2933 > 2933.3 > 2933.39

INN

… … tedisamil … teglarinad chloride … telacebec … telmapitant … teludipine … tenatoprazole … teplinovivint … … … volinaserin … voxelotor … xaliproden … zanapezil … zatolmilast … zidebactam … zindotrine …

Section VI > Chapter 34 > Heading 3404 > 3404.90

Classification opinions

… … 2. Monoglycerides produced from fully hydrogenated edible palm oil. After esterification of the raw material, it …

Section XVI > Chapter 84 > Heading 8486 > 8486.20

Classification opinions

… “dislodged”, they are deposited on the wafer to form a thin film of conductive material. The system is used for coating …

Section XVI > Chapter 84 > Heading 8471 > 8471.90

Classification opinions

… in the graphics industry, particularly for scanning colour films. It consists of several thousand Charge Coupled Device …

Section XVI > Chapter 84 > Heading 8479 > 8479.8 > 8479.89

Classification opinions

… integrated circuit (IC) by using anisotropic conductive film (ACF). During the bonding process, the conductive cable … are laminated by accelerating the solidifying of the film (ACF) under heating and pressure. Application of GIRs 1 …

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