Harmonized System
Section XI > Chapter 52 > Heading 5205 > 5205.1 > 5205.12
… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5205 > 5205.1 > 5205.13
… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.22
… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.23
… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.27
… Measuring less than 106.38 decitex but not less than 83.33 decitex (exceeding 94 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5206 > 5206.1 > 5206.12
… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5206 > 5206.1 > 5206.13
… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5206 > 5206.2 > 5206.22
… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …
Section XI > Chapter 52 > Heading 5206 > 5206.2 > 5206.23
… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …
Section XVIII > Chapter 90 > Heading 9031 > 9031.4 > 9031.41
… For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing …