Harmonized System

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Section XI > Chapter 52 > Heading 5205 > 5205.1 > 5205.12

… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5205 > 5205.1 > 5205.13

… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.22

… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.23

… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5205 > 5205.2 > 5205.27

… Measuring less than 106.38 decitex but not less than 83.33 decitex (exceeding 94 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5206 > 5206.1 > 5206.12

… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5206 > 5206.1 > 5206.13

… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5206 > 5206.2 > 5206.22

… Measuring less than 714.29 decitex but not less than 232.56 decitex (exceeding 14 metric number but not exceeding …

Section XI > Chapter 52 > Heading 5206 > 5206.2 > 5206.23

… Measuring less than 232.56 decitex but not less than 192.31 decitex (exceeding 43 metric number but not exceeding …

Section XVIII > Chapter 90 > Heading 9031 > 9031.4 > 9031.41

… For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing …