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Harmonized System
Section I > Chapter 4 > Heading 0402 > 0402.2
… In powder, granules or other solid forms, of a fat content, by weight, …
Section XV > Chapter 76 > Heading 7611
… of a capacity exceeding 300 l, whether or not lined or heat-insulated, but not fitted with mechanical or thermal …
Explanatory notes
… of a capacity exceeding 300 l, whether or not lined or heat‑insulated, but not fitted with mechanical or thermal …Section XVI > Chapter 84 > Heading 8486
… solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic …
Explanatory notes
… layers on a heated monocrystalline substrate in an ultrahigh vacuum using beams of molecules. The process is … or reticle and exposing the photoresist to light (generally ultraviolet ) or, in some instances, X-rays : (a) Contact … to the contact points of monolithic integrated circuits by ultrasonic or electrical compression welding. (d) Wafer …Section X > Chapter 47 > Heading 4707 > 4707.20
… Other paper or paperboard made mainly of bleached chemical pulp, not coloured in the mass …
Section XVI > Chapter 84 > Heading 8441 > 8441.30
… cases, tubes, drums or similar containers, other than by moulding …
Section XVI > Chapter 84 > Heading 8475 > 8475.10
… assembling electric or electronic lamps, tubes or valves or flashbulbs, in glass envelopes …
Section XVI > Chapter 85 > Heading 8517 > 8517.1
… sets, including smartphones and other telephones for cellular networks or for other wireless networks …
Section V > Chapter 25 > Heading 2515 > 2515.1 > 2515.12
… cut, by sawing or otherwise, into blocks or slabs of a rectangular (including square) shape …
Section V > Chapter 25 > Heading 2516 > 2516.1 > 2516.12
… cut, by sawing or otherwise, into blocks or slabs of a rectangular (including square) shape …
Section I > Chapter 4 > Heading 0402 > 0402.10
… In powder, granules or other solid forms, of a fat content, by weight, …