Explanatory notes
… of any material (Chapter 69); (c) Laboratory glassware (heading 70.17); machinery, appliances or other … printing machines (heading 84.43); or (ii) Water-jet cutting machines (heading 84.56). 3.- A … lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated …Legal note
… of any material (Chapter 69); (c) Laboratory glassware (heading 70.17); machinery, appliances or other … printing machines (heading 84.43); or (ii) Water-jet cutting machines (heading 84.56). 3.- A … lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated …