Harmonized System

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Section XVI > Chapter 84 > Heading 8456

Explanatory notes

… which cut semiconductor chips or which cut or drill ceramic substrates for integrated circuits. (A) MACHINE‑TOOLS FOR …

Section XV > Chapter 81 > Heading 8104

Section XVI > Chapter 85 > Heading 8528

Section I > Chapter 2

Section XIV > Chapter 71 > Heading 7110

Section XX > Chapter 96 > Heading 9602

Section VI > Chapter 38 > Heading 3806

Section XIII > Chapter 70 > Heading 7018

Explanatory notes

… a glass rod. A material containing pearl essence (a pasty substance consisting of certain fish scales dissolved in …

Section XVI > Chapter 84 > Heading 8436

Section XVI > Chapter 84 > Heading 8453

Explanatory notes

… (including parchmenting) processes, and machinery for the subsequent finishing operations. It also covers machinery …